ROG Maximus XII Formula • LGA 1200 socket for 10th-gen Intel® Core™ desktop processors • AI Enhancements: AI Overclocking, AI Cooling and AI Networking (from Game First VI) • Robust power delivery: Optimized power solution with 16 power stages, ProCool II power connectors, MicroFine Alloy chokes and 10K capacitors • Improved Cooling: OptiMem III, CrossChill EK III with 16 teamed power stages, U‑shaped heatpipe, high conductive thermal pad, ROG water cooling zone, M.2 heatsink and backplate • Next-gen Connectivity: Intel® Wi-Fi 6, 10 GbE Ethernet and Intel® 2.5 Gb Ethernet, three M.2 slots • Leading Customization Options: 2″ LiveDash OLED, 2X addressable header + 2X 4-pin RGB header POWER DELIVERY ENHANCEMENTS Modern CPU architectures up the ante for motherboard power design by transitioning from deep power saving modes to full load almost instantaneously. Our latest VRM architecture rises to the challenge by utilizing teamed power stages to rapidly swing current, while maintaining exemplary thermal performance. 1. 8-pin ProCool II power connector: Ensures a snug and reliable connection to the EPS 12V power lines. 2. 70 A power stage: The VRM has 16 power stages, each rated to handle 70 amps. 3. MicroFine alloy chokes: Each Power stage is accompanied by a high-permeability alloy-core choke rated to handle 45 amps. 4. 10K Japanese-made black metallic capacitors: Input and output filtering is provided by solid-polymer capacitors rated to last thousands of hours at high operating temperatures. OPTIMEM III DDR4 4700+ MHZ (O.C.) Boasting proprietary memory trace layout tweaks that improve signal integrity and mitigate noise, ASUS OptiMem III is more compatible with 3600 MHz+ memory kits, allowing them to run at higher frequencies. You can opt to optimize memory for high frequency settings, or low latency settings. With higher capacity memory kits, OptiMem III enables you to run at maximum frequency, whereas other motherboards will trade off frequency for capacity. Stack Maximus XII Formula with your favorite modules and maximize throughput of the new 10th Generation Intel® Core™ Comet Lake-S processor for applications that demand massive bandwidth. CrossChill EK III CrossChill EK III lets you cool with air and water. The redesigned copper cooling channel is wider to provide up to 37.2°C-lower MOSFET temperatures on water, while the standard G1/4″ threaded fittings allow it to fit existing setups for efficient, quiet cooling with minimum effort. 1. G1/4″ threaded design 2. Watertight rubber gasket 3. Copper water channel 4. Multitude of radiating fan STORAGE Three M.2 slots are wired directly to the PCH. One slot supports both SATA and PCIe 3.0 x4 modes, while the other two supports PCIe 3.0 x4 for NVMe. Additional Intel® Optane™ memory recognizes, remembers, and speeds up access to most frequently used files, applications, and games for faster, more responsive performance. Intelligent Motherboard Our ROG engineers developed and extensively-tested intelligent software solutions to ensure your system stays in optimal condition. 1. AI Overclocking: Tuning is now faster and smarter than ever before. AI Overclocking profiles the
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